MediaTek has launched its new Dimensity 6100+ as its new 6000 series looks to tackle reliable 5G connectivity.
This new flagship chip should appear in new Android phones this May, and we're excited to see how well they perform.
After Dimensity 9200, and Dimensity 8200, MediaTek is back with a new Dimensity 7200 SoC aimed at mid-range devices.
OPPO is expected to launch the FInd X6 series soon. The phones are rumored to sport 50MP triple cameras, with at least one model equipped with a 1-inch sensor.
Designed for "flagship-level experiences...at a more accessible price point," the Dimensity 8200 has many of the same perks as the pricier 9200.
The Dimensity 9200 is more likely to come to the United States thanks to the addition of mmWave 5G support.
With new camera capabilities, the Dimensity 1080 takes on Qualcomm for devices at an affordable segment.
MediaTek has announced a mid-year refresh to its flagship Dimensity 9000 chipset. Phones powered by the new Dimensity 9000+ are expected to ship in Q3 2022.
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